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关于三键 | 产品信息 | 技术信息 | 解决方法
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Three Bond technology is used in the following areas:
Electronic chips Back to cellular phone

CSP mounting Flip chip mounting Electroconductive bonding of crystal particles


CSP mounting ThreeBond2274
One-part heating   单组分环氧树脂


将电子零件固定的一种底部填充胶。
ThreeBond 2274 能在很多不同的便携式电子设备中使用,从电话到笔记本电脑,到保护IC封装片的贴装(例如BGA,CSP)免受震动和热循环而导致的掉落。而且ThreeBond 2274也提供了返修的可能性。

Impact resistance

Excellent reparable property

Excellent adhesive strength

Chart of coating method of underfill agents


Frip chip mounting ThreeBond3372C
Bonding with heat and pressure   微胶囊各向异性导电胶

针对LSI中的微间距粘结
电子设备的电子电路板上的LSIs或者移动电话需要高度精细的贴装。而ThreeBond 3372C 通过使用一种绝缘涂覆的微胶囊导电填料是这种贴装成为可能。


Connection of fine-pitch terminals

Stable low connection resistance

Simplifying mounting process
Chart of assembling process of liquid crystal panel


Electroconductive bonding of crystal particles ThreeBond3303E
Heating   导电胶

石英振荡器的主流SMD
由于近来电子设备的集成度越来越高,石英振荡器的主流已经逐渐从变为SMD型(表面贴装设备)三键开发了ThreeBond 3303E,一种用于SMD 型振荡器的胶粘剂。 这种胶粘剂具有更强的抗震性能。


High adhesive strength High resistance to heat
Low outgas Impact resistance
Change of chip bonding strength during high temperature aging

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